01/23/2007
Light Reading:
"Cortina Intros Aggregator IC"
SUNNYVALE, Calif. -- Cortina Systems® (Cortina), a leading supplier of intelligent communication solutions, today announced the market's highest density 10Gbps Ethernet MAC Aggregator IC, CS3477, which doubles the bandwidth over previous components to meet the new density requirements of leading communication system providers.
CS3477 integrates direct serial connectivity to XFP optical modules to eliminate power draw, cost and size from the separate serializer chips in use today. With both 10GE LAN and WAN PHY integration it addresses enterprise and metro needs. The four 10GE MACs include industry-leading Layer 5 classification capabilities to identify and protect critical traffic flows, and provides a complete 10GE solution for both wire speed blades optimized for performance as well as oversubscribed blades optimized for port density and cost. This level of performance is enabled by the use of Interlaken uplink ports, an open industry standard created by Cortina and Cisco for inter-component connectivity.
"Cortina partnered with leading networking companies to create CS3477 which delivers the highest density, lowest power aggregation for both wire speed and over subscribed systems,” said Zino Chair, vice president of marketing at Cortina. “With its native XFP connectivity eliminating the need for surrounding components, the CS3477 enables a generation step in high density line cards.”
CS3477 integrates direct serial connectivity to XFP optical modules to eliminate power draw, cost and size from the separate serializer chips in use today. With both 10GE LAN and WAN PHY integration it addresses enterprise and metro needs. The four 10GE MACs include industry-leading Layer 5 classification capabilities to identify and protect critical traffic flows, and provides a complete 10GE solution for both wire speed blades optimized for performance as well as oversubscribed blades optimized for port density and cost. This level of performance is enabled by the use of Interlaken uplink ports, an open industry standard created by Cortina and Cisco for inter-component connectivity.
"Cortina partnered with leading networking companies to create CS3477 which delivers the highest density, lowest power aggregation for both wire speed and over subscribed systems,” said Zino Chair, vice president of marketing at Cortina. “With its native XFP connectivity eliminating the need for surrounding components, the CS3477 enables a generation step in high density line cards.”