Interlaken Specification

Interlaken is a new chip-to-chip interconnect protocol designed to enable the next milestone in networking integration. Developed jointly by Cortina and Cisco Systems, Interlaken provides a framework for channelized packet interfaces built upon a flexible and highly efficient serdes physical layer. Utilizing the latest 6.25 Gbps serdes technology, it facilitates interfaces that scale from 10 Gbps up to 100 Gbps and beyond.

By leveraging the best features of existing technologies, Interlaken removes the interconnect as a barrier to developing the next-generation of highly integrated communications and networking silicon.

This technology is provided royalty-free to the industry by Cortina and Cisco in the interests of developing an ecosystem of interoperable silicon products. Kindly fill out the form below and we will send you a copy of the specification to the email address provided.

Interlaken Technology Whitepaper